Dive into global electronics innovation, revolutionizing sports viewing: China's 8K debut at Paris Olympics, drone shows blending tech & art, smart cameras capturing every thrill. Explore tech's future in sports.
2024/07/29
Unleash electric vehicle innovation with NXP's S32K39 MCUs. High-performance, ASIL-D safety, TSN Ethernet, optimized for multi-motor control in efficient, cost-effective designs.
2024/07/07
Empower software-defined vehicles with NXP's automotive-grade S32N55 microprocessor. 16 lock-step Arm Cortex-R52 cores for high-performance, safe, and integrated control solutions.
2024/07/06
ST's ST54L NFC controller empowers secure mobile payments and digital wallets. With Thales security, enhanced NFC, 3.3MB memory, supports multi-services, eSIM on Google Pixel 8. Pioneering payment safety.
2024/07/05
Discover STMicro's TSB952 dual op-amp: 52MHz bandwidth, 3.3mA low power, rail-to-rail output, 4.5V-36V supply, -40°C to 125°C operation, 4kV ESD protection, in compact 3x3mm DFN8/SO8.
2024/07/04
ST VNF9Q20F, car-grade power switch, VIPower M0-9 MOSFET, STi2Fuse, smart fuse protection, SPI interface, voltage stability, circuit protection, diagnostics, fail-safe mode, 6mm x 6mm QFN package.
2024/07/03
i.MX RT1180 MCU, industrial-grade, real-time communication, TSN switch, EdgeLock® secure, system-level safety, automotive, Ethernet TSN connectivity.
2024/07/02
SK Hynix unveils the world's first HBM3E AI memory, boasting a groundbreaking 1.18 TB/s data rate and advanced cooling tech, revolutionizing AI performance and speed. Now shipping to customers.
2024/06/27
