Samsung launches AM9C1, an 8th-gen V-NAND PCIe 4.0 automotive SSD, with 4,400MB/s read speeds for autonomous vehicles.
2024/12/06
Samsung starts mass production of its 9th-gen V-NAND QLC flash, featuring advanced technologies for higher density, faster speeds, and lower power use, to meet growing AI demands.
意法半导体的ST85MM PLC调制解调器，支持Meters and More及PRIME 1.4标准，提升智能电表灵活性与安全性，推动能源行业数字化。现已上市。
2024/10/25
意法半导体的ST87M01模块集成Vodafone eSIM和NB-IoT/wM-BUS，专为智能表计和资产管理优化，提供安全、灵活的全球连接方案。
2024/10/22
SK hynix launched the GDDR7 DRAM chip with 32Gbps speed, 50% better efficiency, and 74% lower thermal resistance, ideal for AI, HPC, and autonomous driving.
2024/10/11
SK Hynix introduces the world's first 16Gb DDR5 DRAM chip using 6th gen 10nm tech, boosting productivity by 30%, speed by 11%, and efficiency by 9%.
2024/10/10
SK Hynix launches 12L HBM3E DRAM mass production, setting new global benchmarks for speed, capacity, and stability, strengthening AI memory leadership.
2024/10/09
SAMSUNG announces 12nm DDR5 DRAM with 23% lower power, 20% higher efficiency, and 7.2Gbps speed. AMD-compatible, mass production starts in H2 2023.
2024/10/08
