China-US tariff policy: Electronic component supply chain reconstruction path, trader compliance upgrading, seizing global value chain transformation opportunities
2025/05/14
STMicroelectronics' ST87M01 module integrates Vodafone eSIM and NB-IoT/wM-BUS, optimized for smart meters and asset management, delivering secure, flexible global connectivity solutions.
2024/10/22
ST's ST85MM PLC modem works with Meters and More and PRIME 1.4. It boosts smart meter flexibility and security, aiding energy digitalization. Now available.
2024/10/20
Samsung Electronics launches the industry's first 24Gb GDDR7 DRAM chip, exceeding 40Gbps speeds. Fabricated using 5th-gen 10nm process and PAM3 tech, it boosts performance & efficiency by 30%. Designed for data centers and AI workstations, verification starts this year, mass production early 2025.
2024/10/18
SK hynix launched the GDDR7 DRAM chip with 32Gbps speed, 50% better efficiency, and 74% lower thermal resistance, ideal for AI, HPC, and autonomous driving.
2024/10/11
SK Hynix introduces the world's first 16Gb DDR5 DRAM chip using 6th gen 10nm tech, boosting productivity by 30%, speed by 11%, and efficiency by 9%.
2024/10/10
SK Hynix launches 12L HBM3E DRAM mass production, setting new global benchmarks for speed, capacity, and stability, strengthening AI memory leadership.
2024/10/09
SAMSUNG announces 12nm DDR5 DRAM with 23% lower power, 20% higher efficiency, and 7.2Gbps speed. AMD-compatible, mass production starts in H2 2023.
2024/10/08
