AMD Instinct MI300X: Space AI Converged Computing Power & Procurement
AMD Instinct MI300X Release and Market Background
AMD will officially release the Instinct in December 2023 The MI300X accelerator processor is the world's first data center-class AI computing chip to utilize an APU (CPU + GPU fusion) design.
This chip is based on the CDNA3 architecture and utilizes TSMC's 5nm + 6nm hybrid packaging technology, stacking CPU and GPU computing cores in the same package for higher energy efficiency and computing power density.
According to AMD's official data, the MI300X boasts 192GB of HBM3 memory and a bandwidth of up to 5.3TB/s, making it one of the AI computing accelerator chips with the largest memory capacity and highest bandwidth available.
Less than a year after its release, the MI300X has been adopted by NASA Ames, the European Space Agency (ESA), and several deep space research centers for aerospace AI training, orbit simulation, and remote sensing image analysis systems, becoming the "fusion core" of aerospace computing platforms.
AMD Instinct MI300X Technical Architecture and Performance Highlights
| Project | AMD Instinct MI300X | NVIDIA H100 | AMD MI250X (old version) |
|---|---|---|---|
| Architecture | cDNA3 | Hopper | cDNA2 |
| process | 5nm+6nm | 4N | 6nm |
| Video memory capacity | 192GB HBM3 | 80GB HBM3 | 128GB HBM2e |
| Video memory bandwidth | 5.3TB/s | 3.35TB/s | 3.2TB/s |
| Number of GPU cores | 304CU | 132SM | 220CU |
| FP16 performance | 1.5 PFLOPS | 1.0PFLOPS | 0.45PFLOPS |
| Support framework | ROCm 6/PyTorch/TensorFlow | CUDA/TensorRT | ROCm 5 |
| Power consumption | 750W (configurable) | 700W | 560W |
Compared to the previous generation MI250X, the MI300X offers comprehensive upgrades in computing power, memory, and bandwidth. Especially for AI training tasks, its large-capacity HBM3 graphics memory can accommodate larger aerospace AI models without the need for distributed sharding.
Key Applications of the AMD Instinct MI300X in Space AI and Scientific Computing
• Deep Space AI Model Training: The MI300X provides higher FP16/FP32 throughput for on-orbit satellite AI recognition and astronomical data model training.
• Orbital Dynamics Simulation: Leveraging its CPU+GPU hybrid architecture, it enables multi-threaded parallel satellite orbit calculations.
• Astronomical Spectral Analysis: High-bandwidth HBM3 supports real-time multi-spectral fusion and deep-space ray data calculations;• AI Remote Sensing Image Fusion: 192GB of video memory can directly process ultra-high-resolution satellite imagery, improving the accuracy of surface change detection;
• Space AI Edge Training Node: The MI300X's energy-efficient control and multi-GPU communication support enable on-orbit AI nodes to quickly synchronize model parameters.
According to AMD's official collaboration case studies, the "EL CAPITAN" supercomputing project at Lawrence Livermore National Laboratory in the United States has deployed tens of thousands of MI300X chips for nuclear physics, aerospace simulation, and AI training tasks.
Competitive landscape between AMD Instinct MI300X and NVIDIA H100
| Compare items | AMD Instinct MI300XAMD Instinct MI300X | NVIDIA H100NVIDIA H100 |
|---|---|---|
| Core Architecture | CDNA3 + Zen4 Chipset | HopperHopper |
| Video Memory Type | 192GB HBM3192GB HBM3 Interface | 80GB HBM380GB HBM3 Interface |
| total bandwidth | 5.3TB/s5.3TB/s | 3.35TB/s3.35TB/s |
| Computational efficiency | Higher FP16/F32 ratio | Stronger FP8 AI performance |
| Power management | More flexible and adjustable | Higher energy efficiency optimization |
| Development Ecosystem | ROCm 6 (Open) | CUDA (Closed) |
Overall, the AMD Instinct MI300X's greatest advantage lies in its "converged architecture + ultra-large graphics memory," making it ideal for aerospace AI simulation, satellite intelligent modeling, and fusion computing tasks in ground data centers.
The NVIDIA H100, on the other hand, maintains its advantages in AI ecosystem and inference performance. The two complement each other.
Kingrole Trader's Perspective: Space-Grade MI300X Accelerator Chip Supply and Value
As an international electronic component supplier, Kingrole offers genuine AMD Instinct MI300X sourcing services, ensuring both performance and supply:
• Direct sourcing from original channels: Partnering with AMD's official distribution network to ensure authenticity and full batch testing;
• Space-grade screening and packaging support: Available with high-temperature and radiation-resistant versions for aerospace computing environments;
• AI computing system support: Available with HBM3 memory modules, motherboards, and cooling solutions;
• Project pricing optimization: Supports annual contract pricing for scientific research projects and high-volume AI centers;
• International delivery assurance: Kingrole offers global delivery and export compliance certification, covering aerospace and research institutions in North America, Europe, and Asia.
Through Kingrole, customers can not only purchase genuine AMD Instinct MI300X at the best price, but also receive comprehensive system-level support for aerospace AI clusters.