Samsung K4UBE3D4AM-THCL LPDDR4X memory, 4266Mbps high-speed transmission, low power consumption, 32Gb large capacity, extensive temperature control, BGA packaging, suitable for high-end mobile phones, tablets and wearable devices.
Samsung's LPDDR4 16GB K4AAG165WA-BCWE memory is manufactured using a 10nm process and runs at 3200Mbps. Tailored for high-end smart devices, it features large capacity, low power consumption, and fast performance.
32-bit MCU-STM32F405VGT6 ARM Cortex-M4+FPU, 168MHz high-speed processor, 1MB Flash/192KB RAM. Suitable for industrial automation, smart instruments, and high-end robots.
15038PB-B0L-EP AC axial fan with ball bearing design, efficient, reliable operation and thermal overload protector. Suitable for office automation equipment.
FC-BO2D is a high-density organic packaging carrier board produced by TDK Company, which has high integration, excellent heat dissipation performance and high reliability.
The 6DI150A-060 IGBT module has high efficiency, low noise, and low THD characteristics, and can provide precise power control, excellent performance, and stable and reliable power supply.
6SL3351-3AE41-0DA0 inverter power module, the casing is made of aluminum alloy, the internal structure includes a power block, inverter module, air cooling system and safety integrated functions.
6MBP150NA060 is Fuji Electric's IGBT module. It has efficient, reliable and flexible power conversion and control functions and is suitable for 600V/150A AC circuits.
