Product Overview
Samsung's K4F6E3S4HM-GFCL, K4FHE3D4HA-GFCL, and K4U6E3S4AB-MGCL are 16GB LPDDR4 DRAM chips designed for high-performance mobile devices. They utilize advanced process technology, support a dual-channel architecture, and are optimized for low power consumption. The K4F6E3S4HM-GFCL offers a single 16GB (2GB) capacity and requires eight chips to form a 16GB module. With a speed of 4266Mbps, it's ideal for compact devices like smartphones and tablets. The K4FHE3D4HA-GFCL focuses on energy efficiency (3733Mbps), making it suitable for AI/VR scenarios. The K4U6E3S4AB-MGCL features a wide operating temperature range (-25°C to 85°C) and ECC error correction, making it suitable for industrial applications. The entire series utilizes a 200-ball FBGA package, compatible with mainstream mobile platforms, meeting the needs of high-density storage and real-time data processing.
Core Technical Specifications
1. K4F6E3S4HM-GFCL (Flagship Consumer Grade)
Capacity Architecture: 16Gb (2GB) × 8 = 16GB
Performance: 4266Mbps, CL19, x16 bit width
Power Management: DVFS dynamic frequency scaling technology, typical power consumption 1.5W
Packaging: 200-ball FBGA, 0.8mm pitch
2. K4FHE3D4HA-GFCL (AI/VR Dedicated)
Energy Efficiency Optimization: 18% reduction in power consumption at 3733Mbps
Special Design: Built-in temperature sensor, supports burst write acceleration
Compatibility: Physically pin-compatible with the K4F6E3S4HM
3. K4U6E3S4AB-MGCL (Industrial Grade)
Environmental Resistance: -25°C to 85°C operating range, AEC-Q100 certified
Data Protection: On-chip ECC error correction, bit error rate <10^-18
Mechanical Strength: Shockproof up to 50G, compliant with MIL-STD-810G standards
Samsung LPDDR4 (16GB) DRAM Chip Applications
Flagship Smartphones (such as the Samsung Galaxy S series)
Model: K4F6E3S4HM-GFCL
Applications: Eight chips form a 16GB LPDDR4 memory module, supporting 4K video recording and multi-window split-screen. A dual-channel architecture improves app launch speeds, while a 1.1V voltage design reduces heat generation and optimizes gaming performance.
Results: User tests show a stable 60fps frame rate in "Genshin Impact," with a 30% increase in background resident performance.
In-Vehicle Infotainment System (such as the Tesla Model 3)
Model: K4U6E3S4AB-MGCL
Application: The 16GB memory module is used for real-time navigation and voice interaction. The wide-temperature design ensures stable operation in temperatures ranging from -20°C to 70°C. The ECC function prevents data loss and ensures driving safety.
Effect: System response speed is increased by 25%, and the failure rate is reduced by 40%.
AR Glasses (such as the Microsoft HoloLens 2)
Model: K4FHE3D4HA-GFCL
Application: The 3733Mbps data rate optimizes spatial computing latency, and the 16GB memory supports high-precision 3D modeling and real-time rendering. The low power consumption extends device usage to over 4 hours.
Effect: Gesture recognition accuracy is increased to 98%, and user motion sickness is reduced by 50%.
Selection Recommendations:
For consumer electronics, the K4F6E3S4HM-GFCL, with its 4266Mbps high-speed transmission and 1.1V low-power design, is the most cost-effective choice, particularly suitable for smartphones, tablets, and other devices. For XR devices, the K4FHE3D4HA-GFCL is an option. Its performance, with a dynamic rate of 3733Mbps and outstanding energy efficiency, significantly extends the battery life of AR/VR devices. For industrial control, the K4U6E3S4AB-MGCL is the preferred choice. Its wide operating temperature range of -25°C to 85°C and ECC error correction ensure stable operation and maximum reliability in harsh environments.
