GDDR7 DRAM IC Whitepaper: 2025 Specs, Bandwidth & Efficiency

Architectural Innovation of GDDR7 DRAM ICs

The newly released GDDR7 DRAM ICs, manufactured in 2025, utilize TSMC's 12nm process technology, offering a single chip capacity of up to 24Gb. Leveraging innovative PAM4 (quad-level pulse amplitude modulation) technology, GDDR7 DRAM ICs achieve an ultra-high transfer rate of 32Gbps/pin, a 78% performance improvement over GDDR6. Its unique dual-channel design allows for simultaneous read and write operations, making it ideal for real-time rendering scenarios.

GDDR7 DRAM IC Energy Efficiency Breakthrough

At a 1.2V operating voltage, the GDDR7 DRAM IC offers impressive power efficiency. Tested data shows that when operating at 28Gbps, power consumption is only 2.3W/GB, a 40% improvement in energy efficiency. A built-in temperature sensor dynamically adjusts the refresh rate, ensuring stable operation within a temperature range of -40°C to 105°C.

GDDR7 DRAM IC Compatibility Solution

To ensure backward compatibility, the GDDR7 DRAM IC features a programmable I/O interface and supports PCIe 5.0/6.0 dual-mode switching. It has been fully validated for both NVIDIA Ada Lovelace and AMD RDNA3 architectures. We recommend purchasing with the "JEDEC JESD235B" certification mark.