Samsung's 10th-generation V-NAND and AI-based flash memory chip procurement strategy

NAND Flash Chips: Samsung's 2025 Technology Roadmap at a Glance Samsung will continue to launch and showcase next-generation V-NAND and high-bandwidth DRAM solutions in 2025, focusing on the interim needs of "big data and generative AI." In particular, at its ISSCC and FMS 2025 technology presentations, Samsung showcased 10th-Gen V-NAND (400+ active layers, 5.6 GT/s interface) and high-capacity QLC/V-NAND solutions for AI. These solutions directly impact the selection and procurement strategies for server-grade NAND flash chips.

NAND Flash Chip: The Core Upgrade and Significance of 10th-Gen V-NAND

• Stacking and Packaging: 10th-Gen V-NAND boasts a significantly increased number of layers (over 400) and utilizes hybrid bonding and CoP architecture. This significantly increases single-chip capacity and I/O bandwidth, making it ideally suited to the high-capacity, low-latency NAND flash chip requirements of cloud and hyperscale data centers.

• Performance: The new generation of NAND flash memory chips offers improvements in both random read/write and continuous write scenarios, both in terms of interface speed and parallel read/write design. The benefits are particularly significant when caching large file models and storing sparse parameters for AI inference.

• NAND Flash Chips: Optimal Procurement Cost and Kingrole Solution

• Core Layer (High Performance, Low Latency): Utilizes a NAND flash memory chip configuration combining 10th/9th Gen high-speed V-NAND and high-bandwidth DRAM for AI inference servers and hot data caching.

• Capacity Tier (Massive Cold Data): Prioritize QLC high-density NAND flash memory chips to reduce $/TB costs.

• Secondary Tier (Edge/Automotive/Embedded): Select low-power, fully certified UFS/eMMC or LPDDR variants.

Kingrole can provide the best pricing and fast delivery guarantee (including origin traceability and original manufacturer warranty coordination) for genuine NAND flash memory chips based on procurement volume and channel inventory.

NAND Flash Chip: Performance Comparison — Samsung vs. Competitors (SK Hynix, Micron)

• Capacity and Layer Count: SK Hynix is also actively advancing its 9th/10th generation roadmap in terms of layer count and mass production pace. Samsung has demonstrated differentiated advantages in 10th generation with hybrid bonding and CoP. However, some media outlets have noted that mass production of some V9 QLC products has been delayed (pay attention to delivery timing and price fluctuations).

• Ecosystem and Controller: Samsung has demonstrated integration advantages in SSD controllers (5nm) and overall system optimization (such as the 9100 PRO series). When purchasing NAND flash memory chips, consider controller compatibility and overall firmware support.

Kingrole's Procurement and Technical Support Highlights (Our Commitment to Customers)

• Factory Traceability: Use only authorized channels, providing Samsung/factory certification and serial number comparison.

• Optimize procurement costs: Through volume negotiations, excess inventory recovery, and long-term partnership discounts, Kingrole can help customers achieve near-market or even above-market NAND flash chip cost advantages.

• Technical support: Capacity tiering recommendations, test baselines, and compatibility reports (for server manufacturers and SSD integrators) are provided to reduce post-purchase integration risks.

NAND Flash Chips: Implementation Recommendations and Deployment Strategies

For data center and AI solution providers, based on Samsung's 2025 NAND flash chip technology trends (high-layer stacking, hybrid bonding, and high-speed interfaces), in the short term, they should:

• High random performance and bandwidth scenarios: Prioritize 10th-Gen/9th-Gen series alternatives.

• Cost-sensitive, high-capacity scenarios: Consider QLC and high-density packaging NAND flash chips.

At the same time, Kingrole can assist with negotiations and delivery to leverage cost advantages.